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Co-authors
- Xingde Li, PhDDepartment of Biomedical Engineering, Johns Hopkins UniversityVerified email at jhu.edu
- Wu Yuan,PhDAssistant Professor in Department of Biomedical Engineering, the Chinese University of Hong Kong.Verified email at cuhk.edu.hk
- Ki-Hun Jeong 정기훈Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST)Verified email at kaist.ac.kr
- Dawei LiPeking UniversityVerified email at pku.edu.cn
- Yeong-Hyeon SeoSamsung Electronics, DX, Global Technology Research (GTR)Verified email at samsung.com
- Defu Chen 陈德福Assistant Professor in School of Medical Technology, Beijing Institute of TechnologyVerified email at jhmi.edu
- Cheol SongDGISTVerified email at dgist.ac.kr
- Jessica MavadiaJohns Hopkins UniversityVerified email at jhmi.edu
- Lonny YarmusJohns Hopkins UniversityVerified email at jhmi.edu
- Xinwen Yao 姚昕文Applied Materials Singapore Pte LtdVerified email at ntu.edu.sg
- Minseok KangCzech Adademy of SciencesVerified email at iem.cas.cz
- Huikai XieProfessor of Microelectronics and MEMS, Beijing Institute of TechnologyVerified email at bit.edu.cn
- Xiaoyang ZhangDisplay Engineer, Apple Inc.Verified email at ufl.edu
- Seung Zhoo YoonProfessor, Department of Anesthesiology, College of Medicine, Korea University, Seoul, KoreaVerified email at korea.ac.kr
- Milad AlemohammadJohns Hopkins UniversityVerified email at jhu.edu
- Seung-Hwan BaekAssistant Professor of Computer Science and Engineering, POSTECHVerified email at postech.ac.kr
- Kyung-Won JangKAISTVerified email at kaist.ac.kr
- Yong JeongProfessor, Bio and Brain Engineering, KAISTVerified email at kaist.ac.kr
- Sang-Gil ParkGauss Labs