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Douglas C Hopkins
Douglas C Hopkins
Professor of Electrical and Computer Engineering
Verified email at NCSU.EDU - Homepage
Title
Cited by
Cited by
Year
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
H Ye, C Basaran, D Hopkins
Applied Physics Letters 82 (7), 1045-1047, 2003
3042003
Extension of battery life via charge equalization control
ST Hung, DC Hopkins, CR Mosling
IEEE transactions on industrial electronics 40 (1), 96-104, 1993
2691993
Dynamic equalization during charging of serial energy storage elements
DC Hopkins, CR Mosling, ST Hung
IEEE Transactions on Industry Applications 29 (2), 363-368, 1993
891993
Damage mechanics of microelectronics solder joints under high current densities
H Ye, C Basaran, DC Hopkins, D Frear, JK Lin
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
782004
Mechanical degradation of microelectronics solder joints under current stressing
H Ye, C Basaran, DC Hopkins
International Journal of Solids and Structures 40 (26), 7269-7284, 2003
742003
Failure modes of flip chip solder joints under high electric current density
C Basaran, H Ye, DC Hopkins, D Frear, JK Lin
652005
Numerical simulation of stress evolution during electromigration in IC interconnect lines
H Ye, C Basaran, DC Hopkins
IEEE Transactions on Components and Packaging Technologies 26 (3), 673-681, 2003
652003
THE USE OF EQUALIZING CONVERTERS FOR SERIAL CHARGING OF LONG BATIXRY STRINGS
DC Hopkins, CR Mosling, ST Hung
521991
Misconception of thermal spreading angle and misapplication to IGBT power modules
Y Xu, DC Hopkins
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 545-551, 2014
462014
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
H Ye, C Basaran, DC Hopkins
International Journal of Solids and Structures 41 (9-10), 2743-2755, 2004
462004
Measurement of high electrical current density effects in solder joints
H Ye, DC Hopkins, C Basaran
Microelectronics Reliability 43 (12), 2021-2029, 2003
462003
Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters
MM Jovanovic, DC Hopkins, FCY Lee
IEEE transactions on power electronics 4 (1), 136-146, 1989
461989
Deformation of solder joint under current stressing and numerical simulation––I
H Ye, C Basaran, DC Hopkins
International journal of solids and structures 41 (18-19), 4939-4958, 2004
442004
Flexible epoxy-resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality
X Zhao, B Gao, Y Jiang, L Zhang, S Wang, Y Xu, K Nishiguchi, Y Fukawa, ...
2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4011-4018, 2017
382017
Experimental damage mechanics of micro/power electronics solder joints under electric current stresses
H Ye, C Basaran, DC Hopkins
International Journal of Damage Mechanics 15 (1), 41-67, 2006
382006
6.0 kV, 100A, 175kHz super cascode power module for medium voltage, high power applications
B Gao, AJ Morgan, Y Xu, X Zhao, DC Hopkins
2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 1288-1293, 2018
362018
Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter
DC Hopkins, MM Jovanovic, FCY Lee, FW Stephenson
IEEE transactions on power electronics 4 (1), 147-154, 1989
341989
Two-megahertz off-line hybridized quasi-resonant converter
DC Hopkins, MM Jovanovicm, FC Lee, FW Stephenson
1987 2nd IEEE Applied Power Electronics Conference and Exposition, 105-114, 1987
341987
A framework for developing power electronics packaging
DC Hopkins, SCO Mathuna, AN Alderman, J Flannery
APEC'98 Thirteenth Annual Applied Power Electronics Conference and …, 1998
331998
High current medium voltage bidirectional solid state circuit breaker using SiC JFET super cascode
U Mehrotra, B Ballard, DC Hopkins
2020 IEEE Energy Conversion Congress and Exposition (ECCE), 6049-6056, 2020
312020
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