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Douglas C Hopkins
Douglas C Hopkins
Professor of Electrical and Computer Engineering
Verified email at NCSU.EDU - Homepage
Title
Cited by
Cited by
Year
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
H Ye, C Basaran, D Hopkins
Applied Physics Letters 82 (7), 1045-1047, 2003
3062003
Extension of battery life via charge equalization control
ST Hung, DC Hopkins, CR Mosling
IEEE transactions on industrial electronics 40 (1), 96-104, 1993
2661993
Dynamic equalization during charging of serial energy storage elements
DC Hopkins, CR Mosling, ST Hung
IEEE Transactions on Industry Applications 29 (2), 363-368, 1993
871993
Damage mechanics of microelectronics solder joints under high current densities
H Ye, C Basaran, DC Hopkins, D Frear, JK Lin
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
802004
Mechanical degradation of microelectronics solder joints under current stressing
H Ye, C Basaran, DC Hopkins
International journal of solids and structures 40 (26), 7269-7284, 2003
752003
Numerical simulation of stress evolution during electromigration in IC interconnect lines
H Ye, C Basaran, DC Hopkins
IEEE Transactions on Components and Packaging Technologies 26 (3), 673-681, 2003
652003
Failure modes of flip chip solder joints under high electric current density
C Basaran, H Ye, DC Hopkins, D Frear, JK Lin
622005
THE USE OF EQUALIZING CONVERTERS FOR SERIAL CHARGING OF LONG BATIXRY STRINGS
DC Hopkins, CR Mosling, ST Hung
531991
Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters
MM Jovanovic, DC Hopkins, FCY Lee
IEEE transactions on power electronics 4 (1), 136-146, 1989
471989
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
H Ye, C Basaran, DC Hopkins
International Journal of Solids and Structures 41 (9-10), 2743-2755, 2004
462004
Measurement of high electrical current density effects in solder joints
H Ye, DC Hopkins, C Basaran
Microelectronics Reliability 43 (12), 2021-2029, 2003
462003
Deformation of solder joint under current stressing and numerical simulation––I
H Ye, C Basaran, DC Hopkins
International journal of solids and structures 41 (18-19), 4939-4958, 2004
432004
Misconception of thermal spreading angle and misapplication to IGBT power modules
Y Xu, DC Hopkins
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 545-551, 2014
422014
Experimental damage mechanics of micro/power electronics solder joints under electric current stresses
H Ye, C Basaran, DC Hopkins
International Journal of Damage Mechanics 15 (1), 41-67, 2006
382006
6.0 kV, 100A, 175kHz super cascode power module for medium voltage, high power applications
B Gao, AJ Morgan, Y Xu, X Zhao, DC Hopkins
2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 1288-1293, 2018
352018
Flexible epoxy-resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality
X Zhao, B Gao, Y Jiang, L Zhang, S Wang, Y Xu, K Nishiguchi, Y Fukawa, ...
2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4011-4018, 2017
352017
Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter
DC Hopkins, MM Jovanovic, FCY Lee, FW Stephenson
IEEE transactions on power electronics 4 (1), 147-154, 1989
351989
A framework for developing power electronics packaging
DC Hopkins, SCO Mathuna, AN Alderman, J Flannery
APEC'98 Thirteenth Annual Applied Power Electronics Conference and …, 1998
331998
Two-megahertz off-line hybridized quasi-resonant converter
DC Hopkins, MM Jovanovicm, FC Lee, FW Stephenson
1987 2nd IEEE Applied Power Electronics Conference and Exposition, 105-114, 1987
321987
Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
AJ Morgan, Y Xu, DC Hopkins, I Husain, W Yu
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 2141-2146, 2016
302016
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