Douglas C Hopkins
Douglas C Hopkins
Professor of Electrical and Computer Engineering
Verified email at NCSU.EDU - Homepage
Title
Cited by
Cited by
Year
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
H Ye, C Basaran, D Hopkins
Applied Physics Letters 82 (7), 1045-1047, 2003
2922003
Extension of battery life via charge equalization control
ST Hung, DC Hopkins, CR Mosling
IEEE Transactions on Industrial Electronics 40 (1), 96-104, 1993
2491993
Dynamic equalization during charging of serial energy storage elements
DC Hopkins, CR Mosling, ST Hung
IEEE Transactions on Industry Applications 29 (2), 363-368, 1993
831993
Damage mechanics of microelectronics solder joints under high current densities
H Ye, C Basaran, DC Hopkins, D Frear, JK Lin
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
762004
Mechanical degradation of microelectronics solder joints under current stressing
H Ye, C Basaran, DC Hopkins
International journal of solids and structures 40 (26), 7269-7284, 2003
702003
Numerical simulation of stress evolution during electromigration in IC interconnect lines
H Ye, C Basaran, DC Hopkins
IEEE Transactions on Components and Packaging Technologies 26 (3), 673-681, 2003
612003
Failure modes of flip chip solder joints under high electric current density
C Basaran, H Ye, DC Hopkins, D Frear, JK Lin
592005
THE USE OF EQUALIZING CONVERTERS FOR SERIAL CHARGING OF LONG BATIXRY STRINGS
DC Hopkins, CR Mosling, ST Hung
481991
Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters
MM Jovanovic, DC Hopkins, FCY Lee
IEEE transactions on power electronics 4 (1), 136-146, 1989
471989
Measurement of high electrical current density effects in solder joints
H Ye, DC Hopkins, C Basaran
Microelectronics Reliability 43 (12), 2021-2029, 2003
452003
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
H Ye, C Basaran, DC Hopkins
International Journal of Solids and Structures 41 (9-10), 2743-2755, 2004
442004
Deformation of solder joint under current stressing and numerical simulation––I
H Ye, C Basaran, DC Hopkins
International journal of solids and structures 41 (18-19), 4939-4958, 2004
412004
Experimental damage mechanics of micro/power electronics solder joints under electric current stresses
H Ye, C Basaran, DC Hopkins
International Journal of Damage Mechanics 15 (1), 41-67, 2006
342006
Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter
DC Hopkins, MM Jovanovic, FCY Lee, FW Stephenson
IEEE transactions on power electronics 4 (1), 147-154, 1989
341989
Two-megahertz off-line hybridized quasi-resonant converter
DC Hopkins, MM Jovanovicm, FC Lee, FW Stephenson
1987 2nd IEEE Applied Power Electronics Conference and Exposition, 105-114, 1987
311987
Misconception of thermal spreading angle and misapplication to IGBT power modules
Y Xu, DC Hopkins
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 545-551, 2014
292014
Extension of battery life via charge equalization
ST Tung
IEEE Trans. Ind. Electron. 40 (1), 96-104, 1993
291993
A framework for developing power electronics packaging
DC Hopkins, SCO Mathuna, AN Alderman, J Flannery
APEC'98 Thirteenth Annual Applied Power Electronics Conference and …, 1998
281998
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
H Ye, C Basaran, DC Hopkins, M Lin
Proceedings Electronic Components and Technology, 2005. ECTC'05., 1437-1444, 2005
272005
Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
AJ Morgan, Y Xu, DC Hopkins, I Husain, W Yu
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 2141-2146, 2016
262016
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