Wire bond reliability for power electronic modules-effect of bonding temperature WS Loh, M Corfield, H Lu, S Hogg, T Tilford, CM Johnson 2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007 | 73 | 2007 |
Lifetime prediction for power electronics module substrate mount-down solder interconnect H Lu, T Tilford, DR Newcombe High Density packaging and Microsystem Integration, 2007. HDP'07 …, 2007 | 67 | 2007 |
Design, manufacture and test for reliable 3D printed electronics packaging T Tilford, S Stoyanov, J Braun, JC Janhsen, M Burgard, R Birch, C Bailey Microelectronics Reliability 85, 109-117, 2018 | 38 | 2018 |
Microwave modeling and validation in food thawing applications T Tilford, E Baginski, J Kelder, K Parrott, K Pericleous Journal of Microwave Power and Electromagnetic Energy 41 (4), 30-45, 2006 | 38 | 2006 |
Reliability analysis for power electronics modules C Bailey, T Tilford, H Lu 2007 30th International Spring Seminar on Electronics Technology (ISSE), 12-17, 2007 | 32 | 2007 |
Data driven approach to quality assessment of 3D printed electronic products G Tourloukis, S Stoyanov, T Tilford, C Bailey 2015 38th International Spring Seminar on Electronics Technology (ISSE), 300-305, 2015 | 31 | 2015 |
Predicting the reliability of power electronic modules C Bailey, H Lu, T Tilford Electronic Packaging Technology, 2007. ICEPT 2007. 8th International …, 2007 | 27 | 2007 |
Reliability of power electronic modules H Lu, WS Loh, T Tilford, M Johnson, C Bailey International Electronic Packaging Technical Conference and Exhibition 42789 …, 2007 | 20 | 2007 |
3D-printing and electronic packaging C Bailey, S Stoyanov, T Tilford, G Tourloukis 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2016 | 18 | 2016 |
Multiphysics simulation of microwave curing in micro‐electronics packaging applications T Tilford, KI Sinclair, C Bailey, MPY Desmulliez, G Goussettis, AK Parrott, ... Soldering & surface mount technology, 2007 | 18 | 2007 |
Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar J Blanche, D Flynn, H Lewis, GD Couples, J Buckman, C Bailey, T Tilford IEEE Access 6, 44376-44389, 2018 | 13 | 2018 |
3D-printing and electronic packaging-current status and future challenges C Bailey, S Stoyanov, T Tilford, G Tourloukis 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 1-4, 2016 | 13 | 2016 |
Comparative reliability of inkjet-printed electronics packaging T Tilford, S Stoyanov, J Braun, JC Janhsen, MK Patel, C Bailey IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 12 | 2021 |
Predictive modelling for 3D inkjet printing processes G Tourloukis, S Stoyanov, T Tilford, C Bailey 2016 39th International Spring Seminar on Electronics Technology (ISSE), 257-262, 2016 | 12 | 2016 |
Encapsulation of microelectronic components using open-ended microwave oven SK Pavuluri, M Ferenets, G Goussetis, MPY Desmulliez, T Tilford, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (5 …, 2012 | 12 | 2012 |
Polymer cure modeling for microelectronics applications JE Morris, T Tilford, C Bailey, KI Sinclair, MPY Desmulliez Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar …, 2009 | 12 | 2009 |
Optimization of an open-ended microwave oven for microelectronics packaging KI Sinclair, G Goussetis, MPY Desmulliez, AJ Sangster, T Tilford, C Bailey, ... IEEE transactions on microwave theory and techniques 56 (11), 2635-2641, 2008 | 11 | 2008 |
Predictive reliability and prognostics for electronic components: Current capabilities and future challenges C Bailey, H Lu, S Stoyanov, C Yin, T Tilford, S Ridout 2008 31st International Spring Seminar on Electronics Technology, 67-72, 2008 | 11 | 2008 |
Multi-physics models and condition-based monitoring for 3d-printing of electronic packages C Bailey, S Stoyanov, T Tilford, G Tourloukis 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 9 | 2017 |
Optimizing the reliability of power electronics module isolation substrates C Bailey, T Tilford, S Ridout, H Lu Proceedings of the 2008 International Conference on Engineering Optimization …, 2008 | 9 | 2008 |