Nishant Lakhera, Ph.D.
Cited by
Cited by
Modeling the glass transition of amorphous networks for shape-memory behavior
R Xiao, J Choi, N Lakhera, CM Yakacki, CP Frick, TD Nguyen
Journal of the Mechanics and Physics of Solids 61 (7), 1612-1635, 2013
Partially constrained recovery of (meth) acrylate shape‐memory polymer networks
N Lakhera, CM Yakacki, TD Nguyen, CP Frick
Journal of Applied Polymer Science 126 (1), 72-82, 2012
Characterization of indentation size effects in epoxy
F Alisafaei, CS Han, N Lakhera
Polymer testing 40, 70-78, 2014
Unique recovery behavior in amorphous shape‐memory polymer networks
CM Yakacki, AM Ortega, CP Frick, N Lakhera, R Xiao, TD Nguyen
Macromolecular Materials and Engineering 297 (12), 1160-1166, 2012
Thermo-mechanical behavior and structure of melt blown shape-memory polyurethane nonwovens
DL Safranski, JM Boothby, CN Kelly, K Beatty, N Lakhera, CP Frick, A Lin, ...
Journal of the Mechanical Behavior of Biomedical Materials 62, 545-555, 2016
Effect of viscoelasticity on the spherical and flat adhesion characteristics of photopolymerizable acrylate polymer networks
N Lakhera, A Graucob, AS Schneider, E Kroner, E Arzt, CM Yakacki, ...
International Journal of Adhesion and Adhesives 44, 184-194, 2013
Biodegradable thermoset shape‐memory polymer developed from poly (β‐amino ester) networks
N Lakhera, CM Laursen, DL Safranski, CP Frick
Journal of Polymer Science Part B: Polymer Physics 50 (11), 777-789, 2012
Amorphous-to-crystalline transition of Polyetheretherketone–carbon nanotube composites via resistive heating
AC Martin, N Lakhera, AL DiRienzo, DL Safranski, AS Schneider, ...
Composites Science and Technology 89, 110-119, 2013
Selectively shielded semiconductor package
AK Singh, N Lakhera, NKO Kalandar
US Patent App. 15/719,668, 2019
Repassivation behaviour of stressed aluminium electrodes in aqueous chloride solutions
C Mi, N Lakhera, DA Kouris, DA Buttry
Corrosion science 54, 10-16, 2012
Adhesion behavior of polymer networks with tailored mechanical properties using spherical and flat contacts
N Lakhera, A Graucob, AS Schneider, E Kroner, M Micciché, E Arzt, ...
MRS Communications 3 (1), 73-77, 2013
Systematic tailoring of water absorption in photopolymerizable (meth) acrylate networks and its effect on mechanical properties
N Lakhera, KE Smith, CP Frick
Journal of applied polymer science 128 (3), 1913-1921, 2013
Electronic component package with heatsink and multiple electronic components
NKO Kalandar, AK Singh, N Lakhera
US Patent 9,953,904, 2018
Apparatus and Methods for Multi-Die Packaging
N Lakhera, NKO Kalandar, AK Singh
US Patent App. 15/080,162, 2017
Stackable molded packages and methods of manufacture thereof
AK Singh, N Lakhera, NKO Kalandar
US Patent App. 15/237,827, 2018
Die attachment for packaged semiconductor device
AK Singh, RI Hegde, N Lakhera
US Patent 9,559,077, 2017
On thresholds in the indentation size effect of polymers
AN Bucsek, F Alisafaei, CS Han, N Lakhera
Polymer Bulletin 73, 763-772, 2016
Advanced fan out wafer level package development for small form factor and high-performance microcontroller applications
G Sharma, N Lakhera, M Benson, AJ Mawer
2019 International Wafer Level Packaging Conference (IWLPC), 1-6, 2019
Package with isolation structure
N Lakhera, AJ Mawer, AK Singh, NKO Kalandar
US Patent App. 15/818,004, 2019
Coupled Thermal and Thermo-Mechanical Simulation for Flip-chip Component Level Copper Pillar Bump Fatigue
S Shantaram, ARN Sakib, N Lakhera
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
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Articles 1–20