Get my own profile
Public access
View all25 articles
6 articles
available
not available
Based on funding mandates
Co-authors
Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial ProfessorVerified email at stanford.edu
Mehdi AsheghiAdjunct Professor of Mechanical Engineerig, Stanford UniversityVerified email at stanford.edu
Gang ChenProfessor, Mechanical Engineering, massachusetts institute of technologyVerified email at mit.edu
Justin A. WeibelPurdue UniversityVerified email at purdue.edu
Rajath KantharajMechanical Engineer, Intel CorporationVerified email at intel.com
Namiko YamamotoPenn State UniversityVerified email at psu.edu
Hadi GhasemiUniversity of Houston, MIT, UofTVerified email at uh.edu
George NiMITVerified email at mit.edu
Albraa A. AlsaatiPurdue UniversityVerified email at purdue.edu
Michael T BarakoSenior Staff Scientist, NG Next Basic Research Laboratory, Northrop Grumman Space SystemsVerified email at NorthropGrummanNext.net
Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Selcuk YerciElectrical and Electronics Engineering, ODTU-GUNAM, METUVerified email at metu.edu.tr
Yuqiang ZengSouthern University of Science and Technology. (Previously LBNL & Purdue University)Verified email at sustech.edu.cn
Woosung ParkMechanical Engineering, Hanyang UniversityVerified email at hanyang.ac.kr
Aaditya CandadaiPackaging R&D Engineer, Intel CorporationVerified email at intel.com
Hai M. DuongAssoc Professor, Mechanical Engineering, National University of Singapore (NUS)Verified email at nus.edu.sg
Brian L. WardleProfessor of Aeronautics and Astronautics, Massachusetts Institute of TechnologyVerified email at MIT.EDU
Yuan GaoLieber Institute for Brain Development/Department of Biomedical Engineering, Johns HopkinsVerified email at libd.org
Aalok GaitondePurdue University; Apple; 3D SystemsVerified email at purdue.edu
Ali ShakouriProfessor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu