| Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys KW Moon, WJ Boettinger, UR Kattner, FS Biancaniello, CA Handwerker Journal of electronic materials 29, 1122-1136, 2000 | 701 | 2000 |
| Integrated sustainable life cycle design: a review K Ramani, D Ramanujan, WZ Bernstein, F Zhao, J Sutherland, ... | 656 | 2010 |
| Overview No. 98 I—Geometric models of crystal growth JE Taylor, JW Cahn, CA Handwerker Acta Metallurgica et Materialia 40 (7), 1443-1474, 1992 | 473 | 1992 |
| Effects of Chemical Inhomogeneities on Grain Growth and Microstructure in Al2O3 CA Handwerker, PA Morris, RL Coble Journal of the American Ceramic Society 72 (1), 130-136, 1989 | 261 | 1989 |
| Effect of a liquid phase on the morphology of grain growth in alumina WA Kaysser, M Sprissler, CA HANDWERKER, JE BLENDELL Journal of the American Ceramic Society 70 (5), 339-343, 1987 | 253 | 1987 |
| Equilibrium shape of internal cavities in sapphire JH Choi*, DY Kim*, BJ Hockey, SM Wiederhorn*, CA Handwerker, ... Journal of the American Ceramic Society 80 (1), 62-68, 1997 | 177 | 1997 |
| Dihedral angles in magnesia and alumina: distributions from surface thermal grooves CA Handwerker, JM Dynys, RM Cannon, RL Coble Journal of the American Ceramic Society 73 (5), 1371-1377, 1990 | 158 | 1990 |
| Intrinsic and interdiffusion in Cu-Sn system S Kumar, CA Handwerker, MA Dayananda Journal of phase equilibria and diffusion 32, 309-319, 2011 | 112 | 2011 |
| A Versatile Solution Route to Efficient Cu2ZnSn(S,Se)4 Thin-Film Solar Cells R Zhang, SM Szczepaniak, NJ Carter, CA Handwerker, R Agrawal Chemistry of Materials 27 (6), 2114-2120, 2015 | 96 | 2015 |
| Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles SJ Kim, EA Stach, CA Handwerker Applied Physics Letters 96 (14), 2010 | 95 | 2010 |
| The effect of Pb contamination on the solidification behavior of Sn-Bi solders KW Moon, WJ Boettinger, UR Kattner, CA Handwerker, DJ Lee Journal of electronic materials 30, 45-52, 2001 | 94 | 2001 |
| Research update: lead-free solder alternatives J Bath, C Handwerker, E Bradley Circuits Assembly 11 (5), 30-41, 2000 | 94 | 2000 |
| Stability and surface energies of wetted grain boundaries in aluminum oxide DY Kim, SM Wiederhorn, BJ Hockey, CA Handwerker, JE Blendell Journal of the American Ceramic Society 77 (2), 444-453, 1994 | 91 | 1994 |
| Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration P Sarobol, JE Blendell, CA Handwerker Acta Materialia 61 (6), 1991-2003, 2013 | 90 | 2013 |
| Kesterite Cu2ZnSn(S,Se)4 Absorbers Converted from Metastable, Wurtzite-Derived Cu2ZnSnS4 Nanoparticles WC Yang, CK Miskin, CJ Hages, EC Hanley, C Handwerker, EA Stach, ... Chemistry of Materials 26 (11), 3530-3534, 2014 | 77 | 2014 |
| Calculation of phase equilibria in candidate solder alloys UR Kattner, CA Handwerker International Journal of Materials Research 92 (7), 740-746, 2022 | 75 | 2022 |
| Lead-free electronics: iNEMI projects lead to successful manufacturing E Bradley, CA Handwerker, J Bath, RD Parker, RW Gedney John Wiley & Sons, 2007 | 72 | 2007 |
| Metal–metal chalcogenide molecular precursors to binary, ternary, and quaternary metal chalcogenide thin films for electronic devices R Zhang, S Cho, DG Lim, X Hu, EA Stach, CA Handwerker, R Agrawal Chemical communications 52 (28), 5007-5010, 2016 | 67 | 2016 |
| Jet mill grinding of portland cement, limestone, and fly ash: Impact on particle size, hydration rate, and strength H Sun, B Hohl, Y Cao, C Handwerker, TS Rushing, TK Cummins, J Weiss Cement and Concrete Composites 44, 41-49, 2013 | 64 | 2013 |
| Equilibrium geometries of anisotropic surfaces and interfaces JW Cahn, CA Handwerker Materials Science and Engineering: A 162 (1-2), 83-95, 1993 | 64 | 1993 |
