Rajan Ambat
Rajan Ambat
Professor of Corrosion and Surface Engineering
Bekræftet mail på mek.dtu.dk
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Evaluation of microstructural effects on corrosion behaviour of AZ91D magnesium alloy
R Ambat, NN Aung, W Zhou
Corrosion science 42 (8), 1433-1455, 2000
7682000
Magnesium alloys and their applications
KU Kainer, BL Mordike
Wiley-VCH, 2000
426*2000
Electroless nickel-plating on AZ91D magnesium alloy: effect of substrate microstructure and plating parameters
R Ambat, W Zhou
Surface and Coatings Technology 179 (2-3), 124-134, 2004
3492004
The effect of welding parameters on the corrosion behaviour of friction stir welded AA2024–T351
M Jariyaboon, AJ Davenport, R Ambat, BJ Connolly, SW Williams, ...
Corrosion Science 49 (2), 877-909, 2007
2662007
Studies on the influence of chloride ion and pH on the corrosion and electrochemical behaviour of AZ91D magnesium alloy
R Ambat, NN Aung, W Zhou
Journal of applied electrochemistry 30 (7), 865-874, 2000
2122000
Effect of iron-containing intermetallic particles on the corrosion behaviour of aluminium
R Ambat, AJ Davenport, GM Scamans, A Afseth
Corrosion science 48 (11), 3455-3471, 2006
1882006
Studies on the influence of chloride ion and pH on the electrochemical behaviour of aluminium alloys 8090 and 2014
R Ambat, ES Dwarakadasa
Journal of applied electrochemistry 24 (9), 911-916, 1994
1131994
Intergranular corrosion and stress corrosion cracking of sensitised AA5182
AJ Davenport, Y Yuan, R Ambat, BJ Connolly, M Strangwood, A Afseth, ...
Materials Science Forum 519, 641-646, 2006
1072006
On the electrochemical migration mechanism of tin in electronics
D Minzari, MS Jellesen, P Møller, R Ambat
Corrosion Science 53 (10), 3366-3379, 2011
892011
Rheumatology
R Watts
Oxford Desk Reference, 2009
68*2009
Corrosion failure due to flux residues in an electronic add-on device
MS Jellesen, D Minzari, U Rathinavelu, P Møller, R Ambat
Engineering Failure Analysis 17 (6), 1263-1272, 2010
662010
Electrochemical migration of tin in electronics and microstructure of the dendrites
D Minzari, FB Grumsen, MS Jellesen, P Møller, R Ambat
Corrosion Science 53 (5), 1659-1669, 2011
642011
Electrochemical migration on electronic chip resistors in chloride environments
D Minzari, MS Jellesen, P Moller, P Wahlberg, R Ambat
IEEE Transactions on device and materials reliability 9 (3), 392-402, 2009
642009
Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acids used in no-clean flux systems
V Verdingovas, MS Jellesen, R Ambat
Journal of Electronic Materials 44 (4), 1116-1127, 2015
632015
Electrochemical behavior of the active surface layer on rolled aluminum alloy sheet
R Ambat, AJ Davenport, A Afseth, G Scamans
Journal of the Electrochemical Society 151 (2), B53, 2004
582004
Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies
V Verdingovas, MS Jellesen, R Ambat
IEEE Transactions on Device and Materials Reliability 14 (1), 42-51, 2013
502013
The influence of pH on the corrosion of medium strength aerospace alloys 8090, 2091 and 2014
R Ambat, ES Dwarakadasa
Corrosion science 33 (5), 681-690, 1992
481992
Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components
V Verdingovas, MS Jellesen, R Ambat
Corrosion Engineering, Science and Technology 48 (6), 426-435, 2013
472013
Emeraldine base as corrosion protective layer on aluminium alloy AA5182, effect of the surface microstructure
L Cecchetto, R Ambat, AJ Davenport, D Delabouglise, JP Petit, O Neel
Corrosion science 49 (2), 818-829, 2007
422007
Effect of solder flux residues on corrosion of electronics
KS Hansen, MS Jellesen, P Moller, PJS Westermann, R Ambat
2009 Annual Reliability and Maintainability Symposium, 502-508, 2009
412009
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Artikler 1–20