A mechanism-dependent material model for the effects of grain growth and anisotropy on plastic deformation of magnesium alloy AZ31 sheet at 450 C AJ Carpenter, AR Antoniswamy, JT Carter, LG Hector Jr, EM Taleff Acta materialia 68, 254-266, 2014 | 35 | 2014 |
Plastic deformation and ductility of magnesium AZ31B-H24 alloy sheet from 22 to 450 C AR Antoniswamy, EM Taleff, LG Hector Jr, JT Carter Materials Science and Engineering: A 631, 1-9, 2015 | 26 | 2015 |
Forming-limit diagrams for magnesium AZ31B and ZEK100 alloy sheets at elevated temperatures AR Antoniswamy, AJ Carpenter, JT Carter, LG Hector, EM Taleff Journal of materials engineering and performance 22, 3389-3397, 2013 | 23 | 2013 |
Multi-component integrated heat spreader for multi-chip packages TJ Fitzgerald, AR Antoniswamy, CL Deppisch, NP Patel US Patent 9,330,999, 2016 | 14 | 2016 |
Embedded air core inductors for integrated circuit package substrates with thermal conductor T Fitzgerald, W Lambert, S Kothari, P Sullhan, A Antoniswamy US Patent 9,515,003, 2016 | 10 | 2016 |
Effect of trace addition of in on Sn-Cu solder joint microstructure under electromigration MB Kelly, A Antoniswamy, R Mahajan, N Chawla Journal of Electronic Materials 50, 893-902, 2021 | 8 | 2021 |
Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 2: Corrosion Reliability Testing and Failure Model CU Kim, G Ni, G Kini, JY Chang, A Saha, A Antoniswamy, I Klein, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 7 | 2020 |
Corrosion in Liquid Cooling Systems with Water-based Coolant - Part 1 : Flow Loop Design for Reliability Tests DK G Kini, C-U Kim, H. Madanipour, J-Y Chang, A Saha, A Antoniswamy, I Klein ... 19th IEEE ITHERM Conference, 422-428, 2020 | 6* | 2020 |
Static recrystallization and grain growth in az31b-h24 magnesium alloy sheet AR Antoniswamy, JT Carter, LG Hector, EM Taleff Magnesium Technology 2014, 139-142, 2016 | 6 | 2016 |
Integrated heat spreader having electromagnetically-formed features AR Antoniswamy, TJ Fitzgerald, KM Chakravarthy, S Jain, W Hu, ZZ Tang US Patent 10,763,188, 2020 | 4 | 2020 |
Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review MK PRD Thanu, AR Antoniswamy, R Danaei Reviews of Adhesion and Adhesives 6 (1), 1-25, 2018 | 4 | 2018 |
First-level integration of second-level thermal interface material for integrated circuit assemblies E Bozorg-Grayeli, K Arrington, SC ARGUEDAS, A Antoniswamy US Patent 11,881,438, 2024 | 3 | 2024 |
Filled liquid metal thermal interface materials KJ Arrington, A Mccann, K Lofgreen, AR Antoniswamy, ... US Patent App. 16/662,562, 2021 | 3 | 2021 |
Heat spreaders with interlocked inserts AR Antoniswamy, S Jain, ZZ Tang, W Hu US Patent 10,969,840, 2021 | 3 | 2021 |
Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review DPR Thanu, A Antoniswamy, R Danaei, M Keswani Progress in Adhesion and Adhesives 4, 1-24, 2019 | 3 | 2019 |
Use of Surfactants in Acoustic Cleaning DPR Thanu, A Antoniswamy, VV Swaminathan, ES Srinadhu, N Dole, ... Surfactants in Precision Cleaning, 193-226, 2022 | 2 | 2022 |
Integrated heat spreader (ihs) with solder thermal interface material (stim) bleed-out restricting feature SAC Arguedas, M Dubey, P Li, AR Antoniswamy, A Pancholi US Patent App. 16/516,692, 2021 | 2 | 2021 |
Sintered heat spreaders with inserts W Hu, AR Antoniswamy, TJ Fitzgerald, NP Patel, S Jain, ZZ Tang, ... US Patent App. 15/767,126, 2019 | 2 | 2019 |
The construction and use of physics-based plasticity models and forming-limit diagrams to predict elevated temperature forming of three magnesium alloy sheet materials AR Antoniswamy The University of Texas at Austin, 2013 | 2 | 2013 |
The Influence of Deformation Mechanisms on Rupture of AZ31B Magnesium Alloy Sheet at Elevated Temperatures AR Antoniswamy, AJ Carpenter, JT Carter, LG Hector, EM Taleff Magnesium Technology 2013, 211-215, 2013 | 2 | 2013 |