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Aravindha R Antoniswamy
Aravindha R Antoniswamy
Intel Corporation, University of Texas at Austin
Verificeret mail på intel.com
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A mechanism-dependent material model for the effects of grain growth and anisotropy on plastic deformation of magnesium alloy AZ31 sheet at 450 C
AJ Carpenter, AR Antoniswamy, JT Carter, LG Hector Jr, EM Taleff
Acta materialia 68, 254-266, 2014
352014
Plastic deformation and ductility of magnesium AZ31B-H24 alloy sheet from 22 to 450 C
AR Antoniswamy, EM Taleff, LG Hector Jr, JT Carter
Materials Science and Engineering: A 631, 1-9, 2015
262015
Forming-limit diagrams for magnesium AZ31B and ZEK100 alloy sheets at elevated temperatures
AR Antoniswamy, AJ Carpenter, JT Carter, LG Hector, EM Taleff
Journal of materials engineering and performance 22, 3389-3397, 2013
232013
Multi-component integrated heat spreader for multi-chip packages
TJ Fitzgerald, AR Antoniswamy, CL Deppisch, NP Patel
US Patent 9,330,999, 2016
142016
Embedded air core inductors for integrated circuit package substrates with thermal conductor
T Fitzgerald, W Lambert, S Kothari, P Sullhan, A Antoniswamy
US Patent 9,515,003, 2016
102016
Effect of trace addition of in on Sn-Cu solder joint microstructure under electromigration
MB Kelly, A Antoniswamy, R Mahajan, N Chawla
Journal of Electronic Materials 50, 893-902, 2021
82021
Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 2: Corrosion Reliability Testing and Failure Model
CU Kim, G Ni, G Kini, JY Chang, A Saha, A Antoniswamy, I Klein, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
72020
Corrosion in Liquid Cooling Systems with Water-based Coolant - Part 1 : Flow Loop Design for Reliability Tests
DK G Kini, C-U Kim, H. Madanipour, J-Y Chang, A Saha, A Antoniswamy, I Klein ...
19th IEEE ITHERM Conference, 422-428, 2020
6*2020
Static recrystallization and grain growth in az31b-h24 magnesium alloy sheet
AR Antoniswamy, JT Carter, LG Hector, EM Taleff
Magnesium Technology 2014, 139-142, 2016
62016
Integrated heat spreader having electromagnetically-formed features
AR Antoniswamy, TJ Fitzgerald, KM Chakravarthy, S Jain, W Hu, ZZ Tang
US Patent 10,763,188, 2020
42020
Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review
MK PRD Thanu, AR Antoniswamy, R Danaei
Reviews of Adhesion and Adhesives 6 (1), 1-25, 2018
42018
First-level integration of second-level thermal interface material for integrated circuit assemblies
E Bozorg-Grayeli, K Arrington, SC ARGUEDAS, A Antoniswamy
US Patent 11,881,438, 2024
32024
Filled liquid metal thermal interface materials
KJ Arrington, A Mccann, K Lofgreen, AR Antoniswamy, ...
US Patent App. 16/662,562, 2021
32021
Heat spreaders with interlocked inserts
AR Antoniswamy, S Jain, ZZ Tang, W Hu
US Patent 10,969,840, 2021
32021
Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review
DPR Thanu, A Antoniswamy, R Danaei, M Keswani
Progress in Adhesion and Adhesives 4, 1-24, 2019
32019
Use of Surfactants in Acoustic Cleaning
DPR Thanu, A Antoniswamy, VV Swaminathan, ES Srinadhu, N Dole, ...
Surfactants in Precision Cleaning, 193-226, 2022
22022
Integrated heat spreader (ihs) with solder thermal interface material (stim) bleed-out restricting feature
SAC Arguedas, M Dubey, P Li, AR Antoniswamy, A Pancholi
US Patent App. 16/516,692, 2021
22021
Sintered heat spreaders with inserts
W Hu, AR Antoniswamy, TJ Fitzgerald, NP Patel, S Jain, ZZ Tang, ...
US Patent App. 15/767,126, 2019
22019
The construction and use of physics-based plasticity models and forming-limit diagrams to predict elevated temperature forming of three magnesium alloy sheet materials
AR Antoniswamy
The University of Texas at Austin, 2013
22013
The Influence of Deformation Mechanisms on Rupture of AZ31B Magnesium Alloy Sheet at Elevated Temperatures
AR Antoniswamy, AJ Carpenter, JT Carter, LG Hector, EM Taleff
Magnesium Technology 2013, 211-215, 2013
22013
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Artikler 1–20