| Review of THz-based semiconductor assurance J True, C Xi, N Jessurun, K Ahi, N Asadizanjani Optical Engineering 60 (6), 060901-060901, 2021 | 32 | 2021 |
| Survey of terahertz photonics and biophotonics K Ahi, N Jessurun, MP Hosseini, N Asadizanjani Optical Engineering 59 (6), 061629-061629, 2020 | 26 | 2020 |
| Physical assurance N Asadizanjani, MT Rahman, M Tehranipoor Cham Switzerland: Springer Nature Switzerland AG, 2021 | 20 | 2021 |
| FPIC: A novel semantic dataset for optical PCB assurance N Jessurun, OP Dizon-Paradis, J Harrison, S Ghosh, MM Tehranipoor, ... ACM Journal on Emerging Technologies in Computing Systems 19 (2), 1-21, 2023 | 16 | 2023 |
| Shade: Automated refinement of pcb component estimates using detected shadows NT Jessurun, OP Dizon-Paradis, M Tehranipoor, N Asadizanjani 2020 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-6, 2020 | 12 | 2020 |
| Color normalization for robust automatic bill of materials generation and visual inspection of PCBs OP Paradis, NT Jessurun, M Tehranipoor, N Asadizanjani International Symposium for Testing and Failure Analysis 83348, 172-179, 2020 | 12 | 2020 |
| A framework to assess the security of advanced integrated circuit (ic) packaging C Xi, N Jessurun, N Asadizanjani 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-7, 2020 | 12 | 2020 |
| Terahertz based machine learning approach to integrated circuit assurance J True, C Xi, N Jessurun, K Ahi, M Tehranipoor, N Asadizanjani 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2235-2245, 2021 | 11 | 2021 |
| Physical Assurance for Heterogeneous Integration: Challenges and Opportunities C Xi, A Khan, N Jessurun, N Vashisthan, MM Tehranipoor, ... IEEE International Symposium on the Physical and Failure Analysis of …, 2022 | 8 | 2022 |
| FICS PCB X-ray: A dataset for automated printed circuit board inter-layers inspection D Mehta, J True, OP Dizon-Paradis, N Jessurun, DL Woodard, ... Cryptology ePrint Archive 2022, 2022 | 7 | 2022 |
| A Comparison of Neural Networks for PCB Component Segmentation A Pasunuri, N Jessurun, O Paradis, N Asadizanjani IEEE International Symposium on Hardware Oriented Security and Trust (HOST), 113, 2021 | 7 | 2021 |
| Component detection and evaluation framework (CDEF): A semantic annotation tool N Jessurun, O Paradis, A Roberts, N Asadizanjani Microscopy and Microanalysis 26 (S2), 1470-1474, 2020 | 7 | 2020 |
| Machine Learning Assisted Counterfeit IC Detection through Non-destructive Infrared (IR) Spectroscopy Material Characterization C Xi, N Jessurun, J True, AA Khan, MM Tehranipoor, N Asadizanjani Electronic Components and Technology Conference (ECTC) 72, 2022 | 6 | 2022 |
| QUAINTPEAX QUantifying algorithmically INTrinsic properties of electronic assemblies via X-ray CT J True, N Jessurun, D Mehta, N Asadi Microscopy and Microanalysis 27 (S1), 1222-1225, 2021 | 5 | 2021 |
| An overview of 3D X-ray reconstruction algorithms for PCB inspection A Roberts, J True, NT Jessurun, DN Asadizanjani International Symposium for Testing and Failure Analysis 83348, 188-197, 2020 | 5 | 2020 |
| Semi-Supervised Semantic Annotator (S3A): Toward Efficient Semantic Labeling N Jessurun, DE Capecci, O Dizon-Paradis, DL Woodard, N Asadizanjani Proceedings of the Python in Science Conferences 21, 2022 | 2 | 2022 |
| Digital Twin Aided IC Packaging Structure Analysis for High-quality Sample Preparation C Xi, AA Khan, J True, N Vashistha, N Jessurun, N Asadizanjani 2021 IEEE International Symposium on the Physical and Failure Analysis of …, 2021 | 2 | 2021 |
| PyQtGraph: high performance visualization for all platforms O Moore, N Jessurun, M Chase, N Nemitz, L Campagnola Proc. 22nd Python in Science Conference, 106-113, 2023 | 1 | 2023 |
| PinPoint: An SMD Pin Localization Method N Jessurun, J Harrison, M Tehranipoor, N Asadizanjani International Symposium on the Physical and Failure Analysis of Integrated …, 2022 | 1 | 2022 |
| Microelectronic Encapsulant Material Assessment: A Security Point of View C Xi, J Nathan, N Asadizanjani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 157-162, 2021 | 1 | 2021 |
