Improved reliability of power modules: A review of online junction temperature measurement methods N Baker, M Liserre, L Dupont, Y Avenas | 93 | 2014 |
IGBT junction temperature measurement via peak gate current N Baker, S Munk-Nielsen, F Iannuzzo, M Liserre IEEE Transactions on Power Electronics 31 (5), 3784-3793, 2015 | 49 | 2015 |
Condition monitoring: A decade of proposed techniques Y Avenas, L Dupont, N Baker, H Zara, F Barruel IEEE Industrial Electronics Magazine 9 (4), 22-36, 2015 | 41 | 2015 |
Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters N Baker, M Liserre, L Dupont, Y Avenas IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society …, 2013 | 37 | 2013 |
Online junction temperature measurement via internal gate resistance during turn-on N Baker, S Munk-Nielsen, M Liserre, F Iannuzzo 2014 16th European Conference on Power Electronics and Applications, 1-10, 2014 | 31 | 2014 |
IR camera validation of IGBT junction temperature measurement via peak gate current N Baker, L Dupont, S Munk-Nielsen, F Iannuzzo, M Liserre IEEE Transactions on Power Electronics 32 (4), 3099-3111, 2016 | 29 | 2016 |
Simultaneous on-state voltage and bond-wire resistance monitoring of silicon carbide MOSFETs N Baker, H Luo, F Iannuzzo Energies 10 (3), 384, 2017 | 18 | 2017 |
Test setup for long term reliability investigation of Silicon Carbide MOSFETs N Baker, S Munk-Nielsen, S Bęczkowski 2013 15th European Conference on Power Electronics and Applications (EPE), 1-9, 2013 | 16 | 2013 |
Die degradation effect on aging rate in accelerated cycling tests of SiC power MOSFET modules H Luo, N Baker, F Iannuzzo, F Blaabjerg Microelectronics Reliability 76, 415-419, 2017 | 12 | 2017 |
Online junction temperature measurement using peak gate current N Baker, S Munk-Nielsen, F Iannuzzo, M Liserre 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 1270-1275, 2015 | 12 | 2015 |
Vce-based chip temperature estimation methods for high power IGBT modules during power cycling—A comparison A Amoiridis, A Anurag, P Ghimire, S Munk-Nielsen, N Baker 2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015 | 9 | 2015 |
Experimental evaluation of IGBT junction temperature measurement via peak gate current N Baker, S Munk-Nielsen, F Iannuzzo, L Dupont, M Liserre 2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015 | 9 | 2015 |
An electrical method for junction temperature measurement of power semiconductor switches N Baker Diss., Aalborg University, Denmark, 2016 | 7 | 2016 |
Fabrication of milliwatt modules NB Elsner, JC Bass, S Ghamaty, CC Morris, N Baker, JA Bass Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 …, 1999 | 6 | 1999 |
Experimental evaluation of IGBT junction temperature measurement via a Modified-VCE (ΔVCE_ΔVGE) method with series resistance removal N Baker, F Iannuzzo, S Munk-Nielsen, L Dupont, Y Avenas CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016 | 5 | 2016 |
The Temperature Dependence of the Flatband Voltage in High-Power IGBTs N Baker, F Iannuzzo IEEE Transactions on Industrial Electronics 66 (7), 5581-5584, 2018 | 3 | 2018 |
Failure Protection in Power Modules with Auxiliary-Emitter Bond-Wires N Baker, F Iannuzzo PCIM Europe 2018; International Exhibition and Conference for Power …, 2018 | 3 | 2018 |
Smart SiC MOSFET accelerated lifetime testing N Baker, F Iannuzzo Microelectronics Reliability 88, 43-47, 2018 | 2 | 2018 |
Impact of Kelvin-Source Resistors on Current Sharing and Failure Detection in Multichip Power Modules N Baker, F Iannuzzo, H Li 2018 20th European Conference on Power Electronics and Applications (EPE'18 …, 2018 | 1 | 2018 |
A. s. i. c. prototyping system using programmable gate arrays G Knowles, N Baker Electronic Engineering 63, 55-6, 1991 | 1 | 1991 |