| Unravelling the interplay of crystal structure and electronic band structure of tantalum oxide (Ta 2 O 5) R Nashed, WMI Hassan, Y Ismail, NK Allam Physical Chemistry Chemical Physics 15 (5), 1352-1357, 2013 | 69 | 2013 |
| Recent advances in the use of density functional theory to design efficient solar energy-based renewable systems R Nashed, Y Ismail, NK Allam Journal of Renewable and Sustainable Energy 5 (2), 2013 | 19 | 2013 |
| Self-Assembled nanostructured photoanodes with staggered bandgap for efficient solar energy conversion R Nashed, P Szymanski, MA El-Sayed, NK Allam ACS nano 8 (5), 4915-4923, 2014 | 18 | 2014 |
| Bandgap bowing in Ta-WO system for efficient solar energy conversion: Insights from density functional theory and X-ray diffraction R Nashed, FM Alamgir, SS Jang, Y Ismail, MA El-Sayed, NK Allam Applied Physics Letters 103 (13), 133905, 2013 | 11 | 2013 |
| Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same RNB Said, S Kanakamedala, RS Makala US Patent 11,393,780, 2022 | 9 | 2022 |
| Bonded assembly containing bonding pads spaced apart by polymer material, and methods of forming the same L Hou, P Rabkin, M Higashitani, RNB Said US Patent App. 17/357,040, 2021 | 9 | 2021 |
| Ultra-high mobility in dielectrically pinned CVD graphene R Nashed, C Pan, K Brenner, A Naeemi IEEE Journal of the Electron Devices Society 4 (6), 466-472, 2016 | 8 | 2016 |
| Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same RNB Said, RS Makala, S Kanakamedala, F Zhou, YS Lee US Patent 11,171,097, 2021 | 7 | 2021 |
| Remarkable enhancement of the photocurrent response of dye-sensitized solar cells using CuInSe2 nanocrystals R Nashed, E Girgis, A Shehata, AI Abdel-Salam, MB Mohamed Asia Communications and Photonics Conference, ATh2F. 4, 2012 | 7 | 2012 |
| Bonded assembly containing low dielectric constant bonding dielectric material L Hou, P Rabkin, M Higashitani, RNB Said US Patent 11,646,283, 2023 | 5 | 2023 |
| Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same RNB Said, S Kanakamedala, RS Makala US Patent 11,515,273, 2022 | 5 | 2022 |
| Three-dimensional memory device containing metal-organic framework inter-word line insulating layers RNB Said, S Kanakamedala, F Zhou, RS Makala, YS Lee US Patent 11,387,250, 2022 | 5 | 2022 |
| Semiconductor device containing metal-organic framework inter-line insulator structures and methods of manufacturing the same RNB Said, S Kanakamedala, F Zhou, RS Makala, YS Lee US Patent 11,296,028, 2022 | 5 | 2022 |
| Field emission from graphene sheets and its application in floating gate memories R Nashed, C Pan, K Brenner, A Naeemi Semiconductor Science and Technology 33 (12), 125003, 2018 | 4 | 2018 |
| Area selective deposition of ruthenium on 3D structures K Sondhi, R Sharangpani, RNB Said, J Nag, M Gribelyuk, ... Journal of Vacuum Science & Technology A 40 (6), 2022 | 3 | 2022 |
| Three-dimensional memory device including discrete charge storage elements with laterally-protruding profiles and methods of making thereof RNB Said, RS Makala, S Kanakamedala, F Zhou US Patent App. 17/192,463, 2022 | 3 | 2022 |
| Three-dimensional memory device containing ferroelectric-assisted memory elements and method of making the same RNB Said, A Rajashekhar, S Kanakamedala, RS Makala US Patent App. 17/579,183, 2022 | 3 | 2022 |
| Three-dimensional memory array including dual work function floating gates and method of making the same RNB Said, Y Zhang, J Yuan, RS Makala, S Kanakamedala US Patent 11,631,686, 2023 | 2 | 2023 |
| Accurate determination of interlayer resistivity of 2-D layered systems: graphene case study R Nashed, C Pan, X Wu, I Asselberghs, Z Tokei, F Catthoor, A Naeemi IEEE Transactions on Electron Devices 67 (2), 627-632, 2020 | 2 | 2020 |
| System level analysis and benchmarking of graphene interconnects for low-power applications V Kumar, R Nashed, K Brenner, R Sandhu, A Naeemi 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014 | 2 | 2014 |
Raghuveer MakalaNC State, Rensselaer Polytechnic Institute, Novellus, SanDisk/WDC, Applied MaterialsVerified email at amat.com
