Sue Ann Bidstrup Allen
Sue Ann Bidstrup Allen
Verified email at
Cited by
Cited by
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
PA Kohl, Q Zhao, SAB Allen
US Patent 6,165,890, 2000
Functionalized polynorbornene dielectric polymers: adhesion and mechanical properties
NR Grove, PA Kohl, SA Bidstrup Allen, S Jayaraman, R Shick
Journal of Polymer Science Part B: Polymer Physics 37 (21), 3003-3010, 1999
Plasma‐Enhanced Chemical Vapor Deposition of Silicon Dioxide Deposited at Low Temperatures
Ceiler, Kohl, Bidstrup
Journal of the Electrochemical Society, 1995
Silver metallization for advanced interconnects
R Manepalli, F Stepniak, SA Bidstrup-Allen, PA Kohl
IEEE transactions on advanced packaging 22 (1), 4-8, 1999
Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications
D Bhusari, HA Reed, M Wedlake, AM Padovani, SAB Allen, PA Kohl
Journal of Microelectromechanical Systems 10 (3), 400-408, 2001
Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors
S Ogitani, SA Bidstrup-Allen, PA Kohl
IEEE transactions on advanced packaging 23 (2), 313-322, 2000
Fabrication of microchannels using polycarbonates as sacrificial materials
HA Reed, CE White, V Rao, SAB Allen, CL Henderson, PA Kohl
Journal of Micromechanics and Microengineering 11 (6), 733, 2001
Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates
JP Jayachandran, HA Reed, H Zhen, LF Rhodes, CL Henderson, ...
Journal of Microelectromechanical Systems 12 (2), 147-159, 2003
Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures
S Agraharam, DW Hess, PA Kohl, SA Bidstrup Allen
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17 (6 …, 1999
Underfill of flip chip on laminates: simulation and validation
L Nguyen, C Quentin, P Fine, B Cobb, S Bayyuk, H Yang, ...
IEEE Transactions on Components and Packaging Technologies 22 (2), 168-176, 1999
Biodegradable magnesium/iron batteries with polycaprolactone encapsulation: A microfabricated power source for transient implantable devices
M Tsang, A Armutlulu, AW Martinez, SAB Allen, MG Allen
Microsystems & Nanoengineering 1 (1), 1-10, 2015
Fabrication of semiconductor device with air gaps for ultra low capacitance interconnections and methods of making same
PA Kohl, SAB Allen, CL Henderson, HA Reed, DM Bhusari
US Patent 6,610,593, 2003
Stresses in Thin Film Metallization
Hodge, Bidstrup-Allen, Kohl
Estimated number of cases of high-grade cervical lesions diagnosed among women—United States, 2008 and 2016
NM McClung
MMWR. Morbidity and mortality weekly report 68, 2019
Modeling the Properties of PECVD Silicon Dioxide Films Using Optimized Back-Propagation Neural Networks
Han, Ceiler, Bidstrup, Kohl, May
Components, Packaging, and Manufacturing Technology, 1994
Chemorheology Relations for Epoxy-Amine Crosslinking
SA Bidstrup, CW Macosko
Journal of Polymer Science: Polymer Physics Edition 28 (5), 691-709, 1990
Increased prevalence and geographic spread of the cardiopulmonary nematode Angiostrongylus vasorum in fox populations in Great Britain
CS Taylor, RG Gato, J Learmount, NA Aziz, C Montgomery, H Rose, ...
Parasitology 142 (9), 1190-1195, 2015
Air‐Gaps for Electrical Interconnections
PA Kohl, Q Zhao, K Patel, D Schmidt, SA Bidstrup-Allen, R Shick, ...
Electrochemical and Solid-State Letters 1 (1), 49, 1998
Processing Effects on Optical Anisotropy in Spin Coated Polyimide Films
L Lin, SA Bidstrup
Journal of Applied Polymer Science 49, 1277-1289, 1993
Porous methylsilsesquioxane for low-k dielectric applications
AM Padovani, L Rhodes, L Riester, G Lohman, B Tsuie, J Conner, ...
Electrochemical and Solid-State Letters 4 (11), F25, 2001
The system can't perform the operation now. Try again later.
Articles 1–20