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Co-authors
- Andreas F. MolischProfessor of Electrical Engineering, University of Southern CaliforniaVerified email at usc.edu
- Shengqian HanBeihang University (BUAA)Verified email at buaa.edu.cn
- Vishnu V RatnamStaff Research Engineer 2, Samsung Research AmericaVerified email at samsung.com
- Katsuyuki HanedaAssociate Professor, Department of Electronics and Nanoengineering, Aalto UniversityVerified email at aalto.fi
- Chenwei WangPrincipal Research Engineer, DOCOMO Innovations Inc., Palo Alto, CaliforniaVerified email at uci.edu
- Seun SangodoyinAssistant Professor, ECE, Georgia Institute of TechnologyVerified email at gatech.edu
- Ozgun Y. BursaliogluDocomo InnovationsVerified email at docomoinnovations.com
- Giuseppe CaireProfessor, Technical University of Berlin, Germany, and Professor of Electrical Engineering (onVerified email at tu-berlin.de
- Nadisanka RupasingheSamsung Research AmericaVerified email at samsung.com
- Hao FengIntel LabsVerified email at intel.com
- Bas, Umit CelalettinAppleVerified email at usc.edu