Amir Sajjad Bahman
Title
Cited by
Cited by
Year
Complete loss and thermal model of power semiconductors including device rating information
K Ma, AS Bahman, S Beczkowski, F Blaabjerg
IEEE Transactions on Power Electronics 30 (5), 2556-2569, 2014
1572014
A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules
AS Bahman, K Ma, F Blaabjerg
IEEE Transactions on Power Electronics 33 (3), 2518-2530, 2017
1192017
A 3-D-lumped thermal network model for long-term load profiles analysis in high-power IGBT modules
AS Bahman, K Ma, P Ghimire, F Iannuzzo, F Blaabjerg
IEEE Journal of Emerging and Selected Topics in Power Electronics 4 (3 …, 2016
1132016
Thermal impedance model of high power IGBT modules considering heat coupling effects
AS Bahman, K Ma, F Blaabjerg
2014 International Power Electronics and Application Conference and …, 2014
462014
Mission-Profile-Based Lifetime Prediction for a SiC mosfet Power Module Using a Multi-Step Condition-Mapping Simulation Strategy
L Ceccarelli, RM Kotecha, AS Bahman, F Iannuzzo, HA Mantooth
IEEE Transactions on Power Electronics 34 (10), 9698-9708, 2019
282019
Mission-profile-based stress analysis of bond-wires in SiC power modules
AS Bahman, F Iannuzzo, F Blaabjerg
Microelectronics Reliability 64, 419-424, 2016
252016
Optimization tool for direct water cooling system of high power IGBT modules
AS Bahman, F Blaabjerg
2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016
242016
General 3D lumped thermal model with various boundary conditions for high power IGBT modules
AS Bahman, K Ma, F Blaabjerg
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 261-268, 2016
212016
A fast electro-thermal co-simulation modeling approach for SiC power MOSFETs
L Ceccarelli, AS Bahman, F Iannuzzo, F Blaabjerg
2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 966-973, 2017
192017
Modeling of short-circuit-related thermal stress in aged IGBT modules
AS Bahman, F Iannuzzo, C Uhrenfeldt, F Blaabjerg, S Munk-Nielsen
IEEE Transactions on Industry Applications 53 (5), 4788-4795, 2017
182017
Electrical parasitics and thermal modeling for optimized layout design of high power SiC modules
AS Bahman, F Blaabjerg, A Dutta, A Mantooth
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 3012-3019, 2016
182016
A novel 3D thermal impedance model for high power modules considering multi-layer thermal coupling and different heating/cooling conditions
AS Bahman, K Ma, F Blaabjerg
2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 1209-1215, 2015
182015
Evaluation of current stresses in nine-switch energy conversion systems
Z Qin, PC Loh, AS Bahman, F Blaabjerg
IET Power Electronics 7 (11), 2877-2886, 2014
142014
A modification of offset strip fin heatsink with high-performance cooling for IGBT modules
A Yahyaee, AS Bahman, F Blaabjerg
Applied Sciences 10 (3), 1112, 2020
112020
Evaluation of switch currents in nine-switch energy conversion systems
PC Loh, AS Bahman, Z Qin, F Blaabjerg
IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society …, 2013
112013
Fuzzy-logic-based Mean Time to Failure (MTTF) analysis of interleaved dc-dc converters equipped with redundant-switch configuration
T Rahimi, HK Jahan, F Blaabjerg, AS Bahman, SH Hosseini
Applied Sciences 9 (1), 88, 2019
102019
Lifetime estimation and failure risk analysis in a power stage used in wind-fuel cell hybrid energy systems
S Rastayesh, S Bahrebar, AS Bahman, JD Sørensen, F Blaabjerg
Electronics 8 (12), 1412, 2019
92019
Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs
L Ceccarelli, AS Bahman, F Iannuzzo
Microelectronics Reliability 100, 113336, 2019
92019
Compact sandwiched press-pack SiC power module with low stray inductance and balanced thermal stress
Y Chang, H Luo, F Iannuzzo, AS Bahman, W Li, X He, F Blaabjerg
IEEE Transactions on Power Electronics 35 (3), 2237-2241, 2019
92019
Thermal modeling of wire-bonded power modules considering non-uniform temperature and electric current interactions
M Akbari, AS Bahman, PD Reigosa, F Iannuzzo, MT Bina
Microelectronics Reliability 88, 1135-1140, 2018
92018
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