| Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques: Volume 11 R Kohli, KL Mittal Elsevier, 2018 | 26 | 2018 |
| Book Chapter: Fundamentals and Applications of Sonic Technology DPR Thanu, M Zhao, Z Han, M Keswani Developments in Surface Contamination and Cleaning 11, 1-42, 2018 | 23* | 2018 |
| Use of urea-choline chloride eutectic solvent for back end of line cleaning applications DPR Thanu, S Raghavan, M Keswani Electrochemical and Solid-State Letters 14 (9), H358, 2011 | 21 | 2011 |
| Dilute HF solutions for copper cleaning during BEOL processes: effect of aeration on selectivity and copper corrosion DPR Thanu, N Venkataraman, S Raghavan, O Mahdavi ECS Transactions 25 (5), 109, 2009 | 21 | 2009 |
| Effect of Water Addition to Choline Chloride–Urea Deep Eutectic Solvent (DES) on the Removal of Post-Etch Resid ues Formed on Copper DPR Thanu, S Raghavan, M Keswani IEEE transactions on semiconductor manufacturing 25 (3), 516-522, 2012 | 20 | 2012 |
| Book Chapter: Fundamentals and Applications of Plasma Cleaning DPR Thanu, E Srinadhu, M Zhao, M Keswani, N Dole Developments in Surface Contamination and Cleaning 11, 289-320, 2018 | 17* | 2018 |
| Post plasma etch residue removal in dilute HF solutions DPR Thanu, S Raghavan, M Keswani Journal of the Electrochemical Society 158 (8), H814, 2011 | 11 | 2011 |
| Standoff Spacers for Managing Bondline Thickness in Microelectronic Packages DPR Thanu, H Dhavaleswarapu, J Beatty, S Deshmukh US Patent 10,643,938, 2020 | 7 | 2020 |
| Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques DPR Thanu, ES Srinadhu, M Zhao, NV Dole, M Keswani Elsevier, 2019 | 7 | 2019 |
| Use of dilute hydrofluoric acid and deep eutectic solvent systems for back end of line cleaning in integrated circuit fabrication DPR Thanu PhD dissertation, Materials Science and Engineering, University of Arizona …, 2011 | 7 | 2011 |
| Adhesion Enhancement of Polymer Surfaces by Ion Beam Treatment ES Srinadhu, DPR Thanu, S Putta, M Zhao, B Sengupta, LP Arabandi, ... Polymer Surface Modification to Enhance Adhesion: Techniques and …, 2024 | 4 | 2024 |
| Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review DPR Thanu, A. Antoniswamy, R. Danaei, M. Keswani Reviews of Adhesion and Adhesives 6 (1), 1-25, 2018 | 4 | 2018 |
| Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review DPR Thanu, A Antoniswamy, R Danaei, M Keswani Progress in Adhesion and Adhesives 4, 1-24, 2019 | 3 | 2019 |
| Book Chapter: Use of Surfactants in Acoustic Cleaning DPR Thanu, A Antoniswamy, VV Swaminathan, ES Srinadhu, N Dole, ... Surfactants in Precision Cleaning, 193-226, 2022 | 2 | 2022 |
| Semiconductor package having sealant bridge DPR Thanu, HK Dhavaleswarapu, VS GUTHIKONDA, JJ Beatty, ... US Patent US11676873B2, 2020 | 2 | 2020 |
| Cooling Solution Design for Stress Reduction and Thermal Improvement DPR Thanu, W Hu, C Matayabas, B Bicen, G Luke US Patent Intel Trade Secre t, 2019 | 2* | 2019 |
| Heat Spreader Edge Standoffs for Managing Bondline Thickness in Microelectronic Packages DPR Thanu, H Dhavaleswarapu, J Beatty, S Jain, N Raravikar US Patent 11,062,970, 2021 | 1 | 2021 |
| Fundamental study of polymer to metal bonding in integrated circuit packaging DPR Thanu, R Danaei, A Bermudez, SA Chan, S Prstic International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 1 | 2018 |
| Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review DPR Thanu, B Liu, MA Cartas Journal of Microelectronics and Electronic Packaging 15 (2), 63-74, 2018 | 1 | 2018 |
| Electrochemical Studies of Copper Electrodeposition on Tantalum Barrier DPR Thanu University of Idaho, 2007 | 1 | 2007 |
Manish KeswaniUniversity of ArizonaVerificeret mail på email.arizona.edu
