| The finite element method and applications in engineering using ANSYS® E Madenci, I Guven Springer, 2015 | 1236 | 2015 |
| Predicting crack propagation with peridynamics: a comparative study A Agwai, I Guven, E Madenci International journal of fracture 171, 65-78, 2011 | 259 | 2011 |
| Finite element modeling of BGA packages for life prediction G Gustafsson, I Guven, V Kradinov, E Madenci 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000 | 86 | 2000 |
| Fatigue failure model with peridynamic theory E Oterkus, I Guven, E Madenci 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 78 | 2010 |
| Impact damage assessment by using peridynamic theory E Oterkus, I Guven, E Madenci Central European journal of engineering 2, 523-531, 2012 | 63 | 2012 |
| Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading A Barut, I Guven, E Madenci International Journal of Solids and Structures 38 (50-51), 9077-9109, 2001 | 61 | 2001 |
| Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® E Madenci, I Guven, B Kilic Springer Science & Business Media, 2002 | 45 | 2002 |
| Experimental and numerical characterization of non-Fickian moisture diffusion in electronic packages E Celik, I Guven, E Madenci IEEE transactions on advanced packaging 32 (3), 666-674, 2009 | 34 | 2009 |
| The necessity of reexamining previous life prediction analyses of solder joints in electronic packages T Anderson, I Guven, E Madenci, G Gustafsson 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat …, 1999 | 32 | 1999 |
| Predicting crack initiation and propagation using XFEM, CZM and peridynamics: A comparative study A Agwai, I Guven, E Madenci 2010 Proceedings 60th electronic components and technology conference (ECTC …, 2010 | 31 | 2010 |
| Hydraulic properties of porous sintered glass bead systems I Gueven, S Frijters, J Harting, S Luding, H Steeb Granular matter 19 (2), 28, 2017 | 29 | 2017 |
| Solder joint fatigue life prediction using peridynamic approach F Baber, I Guven Microelectronics Reliability 79, 20-31, 2017 | 27 | 2017 |
| Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory A Agwai, I Guven, E Madenci Microelectronics Reliability 51 (12), 2298-2305, 2011 | 27 | 2011 |
| Mechanical characterization of nickel nanowires by using a customized atomic force microscope E Celik, I Guven, E Madenci Nanotechnology 22 (15), 155702, 2011 | 27 | 2011 |
| Transient two-dimensional thermal analysis of electronic packages by the boundary element method I Guven, CL Chan, E Madenci IEEE transactions on advanced packaging 22 (3), 476-486, 1999 | 27 | 1999 |
| Damage prediction for electronic package drop test using finite element method and peridynamic theory A Agwai, I Guven, E Madenci 2009 59th Electronic Components and Technology Conference, 565-569, 2009 | 26 | 2009 |
| Drop-shock failure prediction in electronic packages by using peridynamic theory A Agwai, I Guven, E Madenci IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (3 …, 2012 | 20 | 2012 |
| Simulations of nanowire bend tests for extracting mechanical properties E Celik, I Guven, E Madenci Theoretical and Applied Fracture Mechanics 55 (3), 185-191, 2011 | 20 | 2011 |
| Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop A Agwai, I Guven, E Madenci 2008 58th Electronic Components and Technology Conference, 1048-1053, 2008 | 20 | 2008 |
| Revisit of life-prediction model for solder joints T Anderson, A Barut, I Guven, E Madenci 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000 | 18 | 2000 |
