| Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ... IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 2013 | 132 | 2013 |
| Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints JCS Jiawei Zhang, Zhou Hai, Sivasubramanian SMTA Journal 25 (3), 19-28, 2012 | 130 | 2012 |
| Impact of isothermal aging on the long-term reliability of fine-pitch ball grid array packages with different Sn-Ag-Cu solder joints J Zhang, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012 | 46 | 2012 |
| Comparative study on impact of various low creep doped lead free solder alloys A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, S Hamasha, ... SMTA International Conference Proceedings, 2017 | 20 | 2017 |
| Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 20 | 2016 |
| Effects of long-term aging on SnAgCu solder joints reliability in mechanical cycling fatigue F Akkara, S Su, S Thirugnanasambandam, A Dawahdeh, A Qasaimeh, ... SMTA International Conference, 17-21, 2017 | 19 | 2017 |
| Proportional Hazard Model of doped low creep lead free solder paste under thermal shock A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 19 | 2016 |
| The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ... 2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013 | 14 | 2013 |
| The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages S Thirugnanasambandam, T Sanders, A Raj, D Stone, J Evans, G Flowers, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 12 | 2014 |
| Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures S Thirugnanasambandam, J Zhang, J Evans, F Xie, M Perry, B Lewis, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 12 | 2012 |
| Reliability of micro-alloyed SnAgCu Based solder interconnections for various harsh applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 11 | 2019 |
| Reliability of doped ball grid array components in thermal cycling after long-term isothermal aging S Gordon, S Thirugnanasambandam, T Sanders, A Raj, S Sridhar, ... SMTA International, 438-442, 2017 | 11 | 2017 |
| Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders Thomas Sanders,Sivasubramanian Thirugnanasambandam,John Evans,Michael Bozack ... SMTA International Conference Proceedings, 2015 | 11* | 2015 |
| Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ... SMTA International Proceedings, 2015 | 11 | 2015 |
| Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders Sivasubramanian Thirugnanasambandam,Thomas Sanders, John Evans, Michael ... SMTA International Conference Proceedings, 2014 | 11* | 2014 |
| Aging effects on creep behaviors of lead-free solder joints and reliability of fine-pitch packages J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ... proc. Surface Mount Technology International Conference, 2012 | 11 | 2012 |
| Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack proc. 45th International Symposium on Microelectronics, 000801-000808, 2012 | 11* | 2012 |
| Proportional Hazard Model of doped low creep lead free solder paste under vibration S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 10 | 2016 |
| DROP RELIABILITY TEST ON DIFFERENT DIMENSIONAL LEAD-FREE WAFER LEVEL CHIP SCALE PACKAGES S Thirugnanasambandam, N Vijayakumar, J Zhang, J Evans, F Xie, ... SMTA International, 2012 | 9 | 2012 |
| Isothermal aging effects on the harsh environment performance of lead-free solder joints J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek SMTA International, 2012 | 5 | 2012 |
Jiawei ZhangAuburn UniversityVerified email at tigermail.auburn.edu
