Influences of device and circuit mismatches on paralleling silicon carbide MOSFETs H Li, S Munk-Nielsen, X Wang, R Maheshwari, S Bęczkowski, ... IEEE Transactions on Power Electronics 31 (1), 621-634, 2015 | 299 | 2015 |
A novel DBC layout for current imbalance mitigation in SiC MOSFET multichip power modules H Li, S Munk-Nielsen, S Beczkowski, X Wang Transaction on Power Electronics 31 (12), 8042 - 8045, 2016 | 115 | 2016 |
Influence of paralleling dies and paralleling half-bridges on transient current distribution in multichip power modules H Li, W Zhou, X Wang, S Munk-Nielsen, D Li, Y Wang, X Dai IEEE Transactions on Power Electronics 33 (8), 6483-6487, 2018 | 110 | 2018 |
Challenges in Switching SiC MOSFET without Ringing H Li, S Munk-Nielsen | 79 | 2014 |
Detail study of SiC MOSFET switching characteristics H Li, S Munk-Nilesen | 73 | 2014 |
A New Resonant Gate Drive Circuit for High Frequency Application of Silicon Carbide MOSFETs JVPS Chennu, R MAHESHWARI, H Li IEEE Transactions on Industrial Electronics, 2017 | 65 | 2017 |
Effects of auxiliary-source connections in multichip power module H Li, S Munk-Nielsen, X Wang, S Bęczkowski, SR Jones, X Dai IEEE Transactions on Power Electronics 32 (10), 7816-7823, 2016 | 61 | 2016 |
Circuit mismatch influence on performance of paralleling silicon carbide MOSFETs H Li, S Munk-Nielsen, C Pham, S Bęczkowski | 54 | 2014 |
Switching current imbalance mitigation in power modules with parallel connected SiC MOSFETs S Bęczkowski, AB Jørgensen, H Li, C Uhrenfeldt, X Dai, S Munk-Nielsen 2017 19th European Conference on Power Electronics and Applications (EPE'17 …, 2017 | 49 | 2017 |
Parallel connection of silicon carbide MOSFETs—Challenges, mechanism, and solutions H Li, S Zhao, X Wang, L Ding, HA Mantooth IEEE Transactions on Power Electronics 38 (8), 9731-9749, 2023 | 46 | 2023 |
Current measurement method for characterization of fast switching power semiconductors with Silicon Steel Current Transformer H Li, S Beczkowski, S Munk-Nielsen, K Lu, Q Wu 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 2527-2531, 2015 | 36 | 2015 |
Direct phase-change cooling of vapor chamber integrated with IGBT power electronic module for automotive application Y Chen, B Li, X Wang, X Wang, Y Yan, X Li, Y Wang, F Qi, H Li IEEE Transactions on Power Electronics 36 (5), 5736-5747, 2020 | 35 | 2020 |
Parallel connection of silicon carbide MOSFETs for multichip power modules H Li | 27 | 2015 |
Temperature-and degradation-dependent maximum electric field stress in wire-bonding power modules under PWM waves Y Lin, Y Zhang, Y Liu, K Wu, H Li, J Wang, K Li, L Ding IEEE Journal of Emerging and Selected Topics in Power Electronics 10 (6 …, 2022 | 21 | 2022 |
Circuit mismatch and current coupling effect influence on paralleling SiC MOSFETs in multichip power modules H Li, S Beczkowski, S Munk-Nielsen, R Maheshwari, T Franke Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015 | 21 | 2015 |
Impact of Kelvin-source resistors on current sharing and failure detection in multichip power modules N Baker, F Iannuzzo, H Li 2018 20th European Conference on Power Electronics and Applications (EPE'18 …, 2018 | 20 | 2018 |
SiC MOSFETs based split output half bridge inverter: Current commutation mechanism and efficiency analysis H Li, S Munk-Nielsen, S Bęczkowski, X Wang | 17 | 2014 |
Comprehensive analysis of paralleled sic mosfets current imbalance under asynchronous gate signals J Wang, C Wang, S Zhao, H Li, L Ding, X Shen, HA Mantooth IEEE Journal of Emerging and Selected Topics in Power Electronics, 2023 | 13 | 2023 |
10kV SiC MOSFET split output power module S Bęczkowski, H Li, C Uhrenfeldt, EP Eni, S Munk-Nielsen 2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015 | 11 | 2015 |
Transient current distribution with paralleling dies and paralleling half bridges in multichip power modules H Li, W Zhou, F Qi, D Li, Y Wang, S Jones, X Dai PCIM Europe 2017; International Exhibition and Conference for Power …, 2017 | 8 | 2017 |